Date:February 23, 2024
Product Characteristics:
Main alloy components: SnAg3Cu0.5, SnAg0.3Cu0.7, SnBi35Ag1.0
Product specifications: 2# (45-75μm), 3# (25-45μm), 4# (20-38μm), 5# (15-25μm), 6# (5-15μm)
Melting point: 138-230°C
Product Application:
Solder paste for temperature-sensitive through-hole elements or connectors in 5G communication, smart wear, semiconductor chip packaging, MiniLED, heat sink module and integrated circuit board