Product Characteristics:

Main alloy components: SnAg3Cu0.5, SnAg0.3Cu0.7, SnBi35Ag1.0

Product specifications: 2# (45-75μm), 3# (25-45μm), 4# (20-38μm), 5# (15-25μm), 6# (5-15μm)

Melting point: 138-230°C

Product Application:

Solder paste for temperature-sensitive through-hole elements or connectors in 5G communication, smart wear, semiconductor chip packaging, MiniLED, heat sink module and integrated circuit board

Product Characteristics:

Executive standard: Q/YXG002-2003

Brand: GB/T728-1998

Main application: This product is used as reducing agent, making alloy, tin-plating products, producing organic tin and products, etc.

Description: Silver white granules with metallic luster.

The physical and chemical properties are the same as that of metallic tin.

Product specification: Shape (round, water drop, oblate) Particle size: 1-2mm, 2-4mm, 4-6mm

Product Characteristics:

Product specification: Preformed soldering lug shall be customized according to ROSH, JIS-Z-3910-2008 and IPC-TM-650-2-2-20 or as required by the user.

Packing specification: The preformed soldering lug can be packed by means of carrier tape, glass bottle, plastic box, film covering, etc.

Application: Preformed solder pads are widely used in IGBT (Insulated Gate Bipolar Transistor) package, SMT package (surface mount), DIP package (dual in-line package), QFN package (square flat leadless package), etc.

Product Characteristics:

Main alloy component: SnAg3Cu0.5

Dimension, specification and precision: Φ0.20~1.3mm, high concentration, Cpk≥1.67

Appearance and properties: silver gray, smooth surface, pollution-free metal ball, accurate alloy composition, high purity, low impurity, low oxygen content (≤100ppm), no cavity, good welding performance

Product Application:

which is used for replacing pins in a chip ( IC element ) packaging structure to realize the functions of circuit connection and mechanical support.

It is applicable to the fields of high-end connector manufacturing, chip packaging and laser positioning welding of precision parts, such as BGA, CSP process packaging, semiconductor packaging, SMT repair, etc.

Features: Silver gray geometric metal.

Executive standard: GB/T728, GB/T8012

Product brands: Sn99.90A, Sn99.90AA, Sn99.95A, Sn99.95AA, Sn99.99A, Sn63PbA, etc.other products with special requirements can be produced.

Specification and shape: board, ball, diamond bar, octagonal bar, star bar, rectangle and other specifications.

but also can produce anodes with different shapes according to the requirements of customers.