Product Characteristics:

Main alloy component: SnAg3Cu0.5

Dimension, specification and precision: Φ0.20~1.3mm, high concentration, Cpk≥1.67

Appearance and properties: silver gray, smooth surface, pollution-free metal ball, accurate alloy composition, high purity, low impurity, low oxygen content (≤100ppm), no cavity, good welding performance

Product Application:

which is used for replacing pins in a chip ( IC element ) packaging structure to realize the functions of circuit connection and mechanical support.

It is applicable to the fields of high-end connector manufacturing, chip packaging and laser positioning welding of precision parts, such as BGA, CSP process packaging, semiconductor packaging, SMT repair, etc.