Prefabricated solder strip-YUNNAN TIN GROUP

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Prefabricated solder strip

Date：February 23, 2024

Product Characteristics:

Product specification: Preformed soldering lug shall be customized according to ROSH, JIS-Z-3910-2008 and IPC-TM-650-2-2-20 or as required by the user.

Packing specification: The preformed soldering lug can be packed by means of carrier tape, glass bottle, plastic box, film covering, etc.

Application: Preformed solder pads are widely used in IGBT (Insulated Gate Bipolar Transistor) package, SMT package (surface mount), DIP package (dual in-line package), QFN package (square flat leadless package), etc.